Next-generation automotive systems are advancing beyond the limits of currently available technologies. The addition of advanced driver assistance systems (ADAS) and other advanced features requires ...
The Compute Express Link (CXL) has emerged as the dominant architecture for pooling and sharing connected memory devices. It was developed to support heterogeneous memory with different performance ...
Microchip Technology introduced the SST26VF, a new family of 3V Serial Quad I/O™ interface (or SQI™ interface) SuperFlash® memory devices. This three-member “26 Series” SQI interface family is ...
NOR flash memory is evolving much in the same way as its cousin, NAND flash: 3D NOR is on the horizon and poised to boost memory densities and dramatically enhance designs. Evolving electronic systems ...
The key technical differences between JESD230G and earlier revisions of the NAND Flash Interoperability Standard. How the new Separate Command Address (SCA) Protocol improves performance by ...
In the world of flash memory, two primary types dominate the market: NOR flash and NAND flash. While they both serve as essential components in various electronic devices, they differ significantly in ...
With a slew of future manned and unmanned space missions on the horizon, Infineon Technologies AG has announced what is reportedly the industry’s first radiation-hardened-by-design 512 Mbit QSPI NOR ...
High Bandwidth Memory (HBM) is the commonly used type of DRAM for data center GPUs like NVIDIA's H200 and AMD's MI325X. High Bandwidth Flash (HBF) is a stack of flash chips with an HBM interface. What ...
Everyone knows them, everyone has them. USB sticks, or thumb drives, are ideal for quickly exchanging data between computers — but also for transporting digital content between mobile phones and PCs ...
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