A former SK Hynix employee has been formally accused of illegally transferring technologies related to advanced chip packaging used for 3D NAND, HBM, and multi-chiplet assemblies as well as CMOS image ...
DENVER – May 31, 2024 – CEA-Leti scientists have reported three projects at ECTC 2024 that they say are steps to enabling CMOS image sensors (CIS) that can exploit image data to perceive a scene, ...
A new generation of CMOS image sensors can exploit all the image data to perceive a scene, understand the situation, and intervene by embedding artificial intelligence (AI) in the sensor. CEA-Leti ...
A technical paper titled “A Review of the Recent Developments in the Fabrication Processes of CMOS Image Sensors for Smartphones” was published by researchers at Texas A&M University. “CMOS Image ...
Scientists at France-based research center CEA-Leti have reported a series of successes in three related projects at the 2024 IEEE 74th Electronic Components and Technology Conference (ECTC 2024) – ...
Figure1: Cross-section-TEM image of an active photodiode (PD) layer transferred to a model signal transfer device (labeled here as a "mount" device). Image taken before subsequent removal of cleave ...
As Micro-LED displays and advanced semiconductor components push the limits of miniaturization and efficiency, precision and scalability in manufacturing become critical. The technology-leading ...
Flip-and-Lap in the fab moves image array to front of imager, which yields sharper, more sensitive pixels, but wafer bonding step adds cost. Tessera Technologies reports a conflict (and resolution) ...
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